Package Reliability Engineer

Overview

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology, you will coordinate package qualification and use reliability test data to support product release recommendations.

What you'll do

• Coordinate package qualification efforts for new products and innovative builds.
• Develop reliability test plans to evaluate risks related to excursions, conversions, and qualification issues.
• Coordinate root cause analysis and corrective actions for qualification failures and RMAs.
• Prepare detailed reports for discussion and review.
• Provide assistance to internal and external customers on package-related quality and reliability inquiries.
• Offer suggestions regarding product launch based on reliability test outcomes.

What you'll need

• Minimum BS degree, M.Sc, or comparable experience in engineering or a related field.
• Detailed understanding of semiconductor component package assembly processes and challenges.
• Understanding of surface mount methods and associated challenges.
• Good understanding of thermomechanical, thermal, mechanical, and hygroscopic swelling stresses affecting package reliability.
• Practical understanding of reliability test techniques, acceleration models, and sampling statistics.
• Good written and verbal communication skills.
• Practical understanding of software systems used in backend manufacturing.

Details

• Location: Gujarat, India.