Overview
Lead thermal simulation (CFD/thermal analysis) and experimental validation of advanced cooling solutions for next-generation high-density server, networking, and data center platforms.
What you'll do
- Develop and execute thermal and CFD models for electronic systems, including servers, networking platforms, and liquid-cooled solutions
- Perform thermal simulations to predict temperature, airflow, and pressure behavior
- Model and analyze cooling technologies such as heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems
- Conduct design trade-off studies and optimization to improve thermal performance, power density, and efficiency
- Drive simulation-based design decisions during early architecture and design phases
- Perform hands-on thermal testing, including system setup, instrumentation, validation, and troubleshooting in lab environments
- Conduct system-level thermal characterization, including airflow, temperature mapping, and pressure drop measurements
- Execute validation of cooling solutions to ensure compliance with performance, reliability, and quality requirements
- Drive correlation between simulation and test results, identifying gaps and improving model fidelity
- Collaborate closely with mechanical, electrical, and system teams to enable optimized and robust thermal designs
- Lead development of thermal strategies, test plans, and modeling guidelines for HPE platforms
What you'll need
- Bachelor's or Master's degree in Computer Science, Information Systems, Electronics, Electrical or equivalent
- Typically 7+ years strong experience in Thermal and CFD models
Details
- Onsite role, with an expectation that you will primarily work from an HPE office
- Job level: TCP_03; function: Engineering
Read the full description and apply on the company’s own careers page.