Principal Engineer, EDG SSD Hardware

Overview

Principal Engineer role leading end-to-end SSD hardware architecture, design, validation and productization within the EDG SSD Hardware group, including automotive and functional-safety hardware work.

What you'll do

• Lead end-to-end SSD hardware architecture, design, validation and productization.
• Own schematic design, component selection, PCB stack-up, placement, routing and design reviews.
• Define hardware requirements covering performance, power, thermal, reliability, form factor and manufacturability.
• Drive high-speed interface design and validation for PCIe, NVMe, ONFI, NAND and other relevant interfaces.
• Lead controller, NAND, DRAM, PMIC, clock, power-delivery and peripheral device integration.
• Develop hardware solutions for standard form factors, including M.2 and BGA, as well as customer-specific automotive and embedded form factors.
• Champion an AI-first engineering mindset across SSD hardware design, validation, debug, and product execution.
• Apply AI-assisted engineering tools to accelerate schematic reviews, component/BOM analysis, design-rule and DFM checks, requirements analysis, technical documentation, and engineering data analysis.
• Develop and deploy Python-based automation and AI-assisted workflows for repetitive hardware engineering tasks, including test-data processing, log analysis, validation reporting, failure triage, and design checks.
• Leverage Generative AI and agentic workflows to capture engineering knowledge, lessons learned, design guidelines, failure history, and reusable debug methodologies.
• Translate customer and system-level automotive requirements into hardware design and validation specifications.
• Design for extended automotive operating temperatures, typically including −40°C to +85°C or +105°C, depending on the product and application requirements.
• Ensure the design meets applicable automotive reliability expectations for temperature cycling and thermal shock, high-temperature operating life, mechanical shock and vibration, humidity and moisture resistance, board-level solder-joint reliability, and power cycling and extended mission-profile operation.
• Support component qualification and product-level assessments aligned with applicable AEC-Q100, AEC-Q104 and AEC-Q200 expectations.
• Apply appropriate design margins and derating guidelines for voltage, current, temperature and component lifetime.
• Address automotive power-transient, brownout, reset, power-loss protection and startup/shutdown sequencing requirements.
• Evaluate system-level EMC and ESD risks and support compliance testing against applicable automotive customer and regional requirements.
• Support requirements related to long product lifecycles, component traceability, controlled BOMs, PCN management and obsolescence planning.
• Collaborate with systems, firmware and functional-safety teams to support product development aligned with ISO 26262.
• Contribute to hardware safety analysis, including Hardware Failure Mode and Effects Analysis, FMEDA inputs, diagnostic coverage assessment, single-point and latent-fault evaluation, and safety mechanism definition and validation.
• Own signal-integrity and power-integrity analysis for high-speed interfaces, NAND channels, clocks and critical power rails, and correlate pre-layout and post-layout simulations with laboratory measurements.
• Optimize PCB stack-up, impedance control, return paths, via structures, power distribution and decoupling.
• Partner with mechanical and thermal teams to evaluate heat spreading, thermal-interface materials, airflow, enclosure constraints and junction-temperature margins.
• Identify and implement opportunities to apply AI and automation across the hardware development lifecycle, including design reviews, PCB/DFM checks, validation, data analysis, debug, and reporting.
• Champion an AI-first and automation-first engineering culture, developing reusable workflows and sharing best practices across the team.

What you'll need

• Exposure to ASIL standards.
• Demonstrated exposure to AI-assisted engineering tools and workflows, with a strong mindset toward adopting AI to improve engineering productivity and quality.
• Ability to leverage tools such as Microsoft Copilot, Claude/Claude Code, or equivalent AI platforms for engineering analysis, documentation, scripting, automation, and technical problem-solving.

Nice to have

• Familiarity with Automotive SPICE development and traceability expectations.

Details

• Location: Bengaluru, Karnataka, India.