Senior Staff Engineer

Overview

Lead ATE test solution development for RF SoC, wireless connectivity, IoT products and microcontrollers, from product development and silicon bring-up through characterization, production testing, qualification and volume manufacturing.

What you'll do

• Lead the development and ownership of ATE test solutions and hardware for wafer-level and package-level testing of SoC, RF, wireless connectivity and IoT products.
• Develop, debug and enhance characterization and production test programs for RF SoCs, wireless connectivity devices and microcontrollers.
• Design and implement multi-site ATE hardware solutions on Teradyne UltraFLEX and UltraFLEX Plus platforms.
• Utilize DFT, circuit design, ATE methodologies, DOE and SPC to drive robust test coverage and product quality.
• Troubleshoot customer application challenges, manage RMA investigations and resolve issues through root-cause analysis.
• Create and optimize test programs while driving yield improvement, test cost reduction and manufacturing efficiency initiatives.
• Validate product performance and compliance with datasheet specifications throughout design optimization and customer qualification phases.
• Provide technical leadership and test engineering support to internal teams and external customers.
• Drive device and package qualification activities for new product introductions and production transfers.
• Support first silicon bring-up, debug, yield enhancement and test-time optimization with design and test teams to achieve production readiness.
• Collaborate with IP Design, Applications, DFT, Product Engineering and Test Engineering teams across global development sites to ensure successful product delivery.

What you'll need

• Minimum 10+ years of experience in ATE test solution development and semiconductor product testing.
• Bachelor’s or Master’s degree in Electronics, Electrical Engineering, Computer Science or a related discipline.
• Hands-on experience developing multi-site test solutions on Teradyne UltraFLEX, UltraFLEX Plus and/or Advantest V93K platforms.
• Strong expertise in Digital, Analog and RF test development.
• Proficiency in programming languages such as VB, C, C++ and Java.
• Automation scripting experience in Perl, Python and/or MATLAB.
• Experience using oscilloscopes, logic analyzers, signal generators, power supplies and source-measure units (SMUs).
• Proven ability to lead projects, drive manufacturing improvements, manage change and implement effective test solutions.
• Strong presentation and communication skills to clearly convey technical concepts and project objectives.
• Ability to work in a fast-paced, collaborative and cross-functional environment.
• Demonstrated technical leadership and mentoring capabilities.
• Excellent interpersonal skills.

Nice to have

• Working knowledge of Teradyne IG-XL, Version 9 and above.

Details

• Location: Bangalore BTP.