Silicon Packaging Architect

Overview

Lead the definition of package architecture for Intel's Data Center Group, translating product requirements into advanced silicon package specifications and delivering end-to-end solutions that meet physical, electrical, thermal, and cost requirements.

What you'll do

• Develop and define package architecture specifications based on product requirements, ensuring alignment with physical, electrical, thermal, and reliability standards.
• Lead technology tradeoff evaluations to deliver optimal solutions that balance performance, manufacturability, and cost.
• Collaborate with silicon, hardware, and packaging teams to ensure high-quality package designs and seamless integration into production workflows.
• Oversee the end-to-end package development process, including design, processes, and procedures, while continuously improving packaging quality standards.
• Troubleshoot packaging design challenges, identify root causes, and implement innovative and cost-effective solutions.
• Partner with manufacturing teams to ensure smooth transitions of packaging designs and tapeouts to production environments.

What you'll need

• Bachelor's degree in a relevant field (e.g., Electrical Engineering, Mechanical Engineering, Materials Science) with 6+ years of hands-on experience in package architecture, design, and development, OR a Master's degree in a relevant field with 4+ years of experience, OR a PhD in a relevant field with 2+ years of experience.
• Proven expertise in package design and associated design tool SW Xpedition.
• Proven expertise in electrical, thermal, and mechanical considerations and tradeoffs.
• Proficiency in simulation tools for package analysis (e.g., thermal, mechanical, and signal integrity simulations).
• Strong understanding of manufacturing processes and procedures for silicon packaging.
• Demonstrated ability to troubleshoot and resolve packaging design challenges effectively.

Nice to have

• Experience collaborating with cross-functional teams, including silicon, hardware, and manufacturing groups.
• Strong communication skills to effectively convey tradeoff decisions and technical solutions.
• Familiarity with industry trends and advancements in silicon packaging technologies.
• Ability to thrive in a fast-paced, innovative environment while driving continuous improvement.

Details

• Location: India, Bangalore.
• Work model: On-site.
• Job type: Experienced hire.
• Shift: Shift 1 (India).