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Silicon Packaging Design Engineer

Intel
NewPosted yesterday

LOCATION

India · Onsite

EXPERIENCE

Any experience

TYPE

FullTime

SALARY

Negotiable

SKILLS REQUIRED

Engineering DrawingsSystem DesignDebuggingPerformance OptimizationPower Delivery Principles

Job description

Overview

Join the Data Center Group as a Silicon Packaging Design Engineer, developing end-to-end substrate designs from concept through tapeout for next-generation technologies.

What you'll do

  • Drive the complete development of substrate designs, starting from initial concept through tapeout.
  • Perform physical layout and routing of package designs while ensuring adherence to design requirements.
  • Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
  • Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
  • Define and implement substrate design rules to meet product and manufacturing requirements.
  • Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
  • Integrate design documentation and collateral into the product lifecycle management system.
  • Seek opportunities to improve package design for manufacturability (DFM) and quality assurance.

What you'll need

  • Diploma in Electronic/Electrical Engineering or a related field.
  • Six months or more years of work experience in the semiconductor field related to design of silicon packaging or PCB.
  • Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
  • Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
  • Familiarity with design for manufacturability (DFM) and quality assurance processes.
  • Strong problem-solving skills with a disciplined approach to execution.

Nice to have

  • Preferred experience with an E-CAD tool.
  • Effective communication skills to convey technical information and collaborate with cross-functional teams.
  • A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
  • Passion for driving innovation and contributing to complex engineering challenges.

Details

  • Location: Bangalore, India.
  • On-site presence is required.
  • Shift: Shift 1 (India).
  • Job type: College Grad.

Read the full description and apply on the company’s own careers page.

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Silicon Packaging Design Engineer