Overview
3D-IC Methodology Architect responsible for developing 3D-IC design and verification methodology, leading technical teams, and driving standards across internal teams, vendors, and customers.
What you'll do
- Develop design and verification methodology for 3D-IC workflows.
- Lead a technical team and drive standards across the organization, vendors, and technical areas.
- Focus on EMAG, thermal, and package flows for multi-die systems.
- Lead methodology development for heterogeneous integration flows, including training for internal design and customers.
- Partner with EDA vendors and internal teams on EDA development flows and PDK integration.
- Scope customer requirements and guide design flow adoption with product line management and marketing.
- Mentor and train junior engineers on effective software and automation features.
What you'll need
- Minimum 15+ years of relevant industry experience (methodology and verification and related work).
- Expertise in methodology design and model verification for RF, AMS, silicon photonics, and packaging design.
- Expert knowledge of industry-standard EDA tools and flows for analog, RF, AMS, and digital design.
- Fluent English (written and verbal) and strong written/oral communication skills.
- Proficient knowledge and experience with Unix environment.
- Ability to collaborate across teams and contribute across multiple concurrent projects.
- B.E. or equivalent degree from an accredited university.
Details
- Location: Bengaluru North, Karnataka, India.
Read the full description and apply on the company’s own careers page.
