Lead Engineer - PCB Design

Overview

Lead the design, development, and optimization of printed circuit board (PCB) solutions for electronic products, ensuring high-quality, manufacturable, and reliable designs. Drive design standardization and process improvements, provide technical leadership, and collaborate with cross-functional teams to deliver innovative and cost-effective products.

What you'll do

• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
• Lead programs with multiple PCBs and deliver with help of one or more resources.
• Design complex multi-layer PCBs for data center power distribution and management systems.
• Design complex multi-layer PCBs for thermal management and cooling control systems.
• Apply know-how of OCP Rack and its structure.
• Develop PCB solutions considering Signal Integrity (SI), Power Integrity (PI), EMC/EMI compliance, thermal performance, reliability, and manufacturability.
• Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
• Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
• Mentor PCB designers and provide technical leadership across global engineering teams.

What you'll need

• Bachelor’s Degree in Electronics, Electronics and Communication, or Electrical Engineering.
• 12–14 years of PCB design experience in power electronics or thermal management products.
• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.
• Strong experience with High Power, Flex, Rigid Flex & HDI PCBS.
• Strong experience with high-speed interfaces including DDR, PCIe, Ethernet, USB, and SerDes.
• Strong experience with power electronics and power conversion systems.
• Strong experience with creepage clearance and safety requirements.
• Strong experience with SI/PI analysis and simulation.
• Strong experience with thermal-aware PCB design.
• Strong experience with DFM, DFA, and DFT methodologies.
• Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.
• Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.
• Strong working knowledge of IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
• Strong working knowledge of Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH.
• Strong leadership, communication, and problem-solving skills.
• Ability to work effectively in cross-functional and global engineering environments.

Nice to have

• Ability to do Power Integrity or Signal Integrity Simulations.
• Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred.
• CAM validation, check and basic editing of Gerber data using CAM350.

Details

• Location: Hadapsar, Pune, Maharashtra, India.