Hewlett Packard Enterprise logo

Mechanical Engineer, Thermal & Packaging

Hewlett Packard Enterprise
NewPosted today

LOCATION

Bengaluru · Onsite

EXPERIENCE

4 - 6 Years

TYPE

FullTime

SKILLS REQUIRED

Thermal AnalysisMechanical DesignCAD DesignComputational Fluid DynamicsElectronics Packaging

Job description

Overview

Mechanical engineering role focused on thermal and packaging design for hardware products, working onsite at an HPE office in Bengaluru.

What you'll do

  • Design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.
  • Develop and implement test plans for new and existing designs, including tolerance analysis, form-fit-function, shock and vibration, EMI, safety, reliability, acoustics, fan curves, and system power measurements.
  • Conduct feasibility studies, design margin analysis, validation, and empirical testing.
  • Use CFD analysis and thermal mockups to validate thermal solutions.
  • Collaborate with management, internal teams, and external development partners on design status, project progress, and issue resolution.
  • Lead mechanical engineering project teams to deliver reliable, cost-effective, and high-quality solutions.
  • Represent the mechanical and thermal engineering team throughout complex product development projects.
  • Provide technical guidance and mentoring to junior engineers.

What you'll need

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 4–6 years of relevant mechanical engineering experience.
  • Proficiency in ProEngineer (ProE/Creo) or other 3D CAD software.
  • Strong understanding of electronics packaging and mechanical hardware design.
  • Experience designing sheet metal and plastic components, including production tooling and manufacturing processes.
  • Knowledge of CFD, thermal simulation, and thermal mockups for thermal validation.
  • Strong analytical, problem-solving, and design validation skills.
  • Excellent written and verbal communication skills in English and the local language.
  • Ability to communicate product architectures and design proposals, negotiate technical options with management, and coordinate cross-functional teams.

Details

  • Work mode: Onsite, with an expectation to primarily work from an HPE office.
  • Location: Bengaluru, Karnātaka, India.

Read the full description and apply on the company’s own careers page.

Stay safe

Hiring on Abekus is free for applicants

We never charge a fee, and employers are prohibited from doing so. If a recruiter asks for payment, please report them right away.

Mechanical Engineer, Thermal & Packaging