Mechanical Engineering Technical Leader

Overview

Lead mechanical and thermal engineering work on complex electro-mechanical products, including central office networking equipment, outdoor mobility equipment, high-performance thermal solutions and PCB assemblies.

What you'll do

• May lead small-scale mechanical engineering projects (one to two features) with manageable risks and resource requirements, and may take on project management responsibilities.
• Collaborate with multiple stakeholders to support assembly, fabrication and manufacturing of products using an understanding of manufacturing processes for plastic, diecast, sheet metal, interconnect and power delivery.
• Conduct failure mode and effects analysis (FMEA).
• Perform stack-up tolerance analyses to ensure designs meet six sigma quality for high-volume mass production.
• Assist senior engineers with test plans, mechanical design testing, failure analysis, reliability, environmental testing and verification plans for developed design elements, materials, parts and products.
• Verify the quality of the design, resolve issues and advance as needed.
• Perform moderately complex simulation with supervision from senior engineers.
• Review and compile the BoM for large teams or across multiple products.
• Contribute to design improvements and assembly cost savings and avoidance by helping identify the right materials.
• Monitor scope, schedule and budgets for projects.
• Collaborate with multiple stakeholders on design feasibility testing and prototyping, including working directly with marketing teams to ensure customer features and requests are achievable.
• Ensure feasibility and prototyping guidelines are met.
• Perform simple mechanical simulations such as FEA analysis to support design features.
• Optimize thermal solutions with thermal engineers prior to prototype.

What you'll need

• Bachelor's + 10-14 years of related experience, or Master's + 8-10 years of related experience, or PhD + 6-8 years of related experience.
• Hands-on thermal design and validation experience in electro-mechanical equipment deployed in environments ranging from central office (controlled) to outdoor (uncontrolled).
• Expertise in concept/architecture, establishing thermal boundaries and optimized cooling solutions that maximise equipment performance with minimal cooling power budget.
• Expertise in design and verification of latest heatsink technologies (heat pipes, chill/cold plates, 2D/3D vapor chambers) for air and liquid cooling.
• Strong validation background and ability to plan a comprehensive test plan with minimal iterations.
• Strong command of simulation tools and modelling of complex thermal environments.

Nice to have

• Strong communication skills with cross-functional collaboration and problem-solving abilities.
• Good knowledge of mechanical design and manufacturing processes.
• Experience in product design validation, particularly in thermal and mechanical areas.
• Good knowledge of fan, TIM and heatsink type selection and verification.
• Experience generating automation tools and Python scripting for data management and smart design and review.
• Hands-on experience with electronics cooling tools such as Flotherm, Flotherm XT, Ansys Icepak, Ansys CFX.
• Hands-on experience in liquid cooling technology, covering testing, design tools and manufacturing techniques.
• ASIC-level knowledge of detailed thermal models including power maps, TIM1, TIM1.5, TIM2 bond line thickness, lidded/lidless and silicon 2D/2.5D etc.
• Hands-on experience using AI tools in day-to-day work.
• Hands-on knowledge of thermal testing tools with DAQs and environmental chambers.
• Proficient in creating test plans, executing tests and reporting results.
• Experienced in handling power supplies, electronic loads, data loggers, thermocouple installation and removal, IR cameras, air velocity sensors and heat sink assemblies.
• Capable of setting up tests, system bring-up and troubleshooting issues with minimal assistance.
• Familiar with MDVT, EDVT, airflow, acoustics and environmental testing for networking products.

Details

• Location: Bangalore, India.