Mechanical Simulation Engineer – Advanced Packaging

Overview

Mechanical Simulation Engineer for advanced semiconductor packaging, focused on thermo-mechanical and multiphysics modeling to enable robust package design.

What you'll do

• Run linear and non-linear static analysis for package and material behavior.
• Perform fatigue, fracture mechanics, and reliability simulations.
• Build multiphysics models across thermo-mechanical, thermal, structural, and fluidic domains.
• Model interfaces including contact, shear, delamination, and interfacial damage.
• Integrate Generative AI/AI Assistant/AI to accelerate simulations and optimize workflows.
• Develop automation workflows for simulation setup, solve, and post-processing.

What you'll need

• 2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging.
• Experience in AI-driven modeling, automation, or data-driven simulation techniques (preferred).

Details

• Location: Hyderabad - Phoenix Aquila, India.