Mechanical Technical Lead Engineer

Overview

Lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment within the WETS Deposition product development team at Lam Research India.

What you'll do

• Design and develop fluid and pneumatic mechanical subsystems for WETS NPD tools
• Apply engineering first principles to solve thermal and fluid dynamics problems
• Perform OEM component selection (e.g. valves, regulators, fittings, tubing, and sensors)
• Design components using plastic and polymer materials for wet and chemical environments
• Lead or contribute to FMEA to identify and mitigate design risks
• Drive issue resolution using structured problem-solving methods (5-Why, Fishbone, Pareto)
• Collaborate with CFTs such as Process, Electrical, Product Support, Supply Chain, and Manufacturing teams
• Own subsystem delivery from concept through qualification and release
• Support prototype build, testing, debugging, and qualification activities
• Maintain clear documentation of designs, calculations, risks, and decisions

What you'll need

• Bachelor's degree in Mechanical Engineering with 5+ years of experience; or Master's degree in Mechanical Engineering with 3+ years of experience
• Excellent communication, both written and verbal, and technical presentation skills
• Highly proficient in 3D CAD tools such as Solid Edge, Siemens NX
• Hands-on experimental and design background coupled with solid engineering skills

Nice to have

• Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware
• Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations
• Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable
• Experience with requirements definition and verification/validation planning at system and subsystem level
• Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability)
• Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control
• Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data
• Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing
• Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews

Details

• Location: Bangalore, India
• Work mode: hybrid, either On-site Flex (3+ days per week on-site, remainder remote) or Virtual Flex (1-2 days per week on-site, remainder remote)