Package Design Staff/Sr.Staff Engineer

Overview

Package Design Staff/Sr. Staff Engineer role focused on high-speed IC package development for advanced microelectronic packages.

What you'll do

• Drive microelectronic package development from concept through tapeout.
• Select appropriate package technologies with package architects and technical leads.
• Develop C4 and BGA ball maps optimized for SI/PI and layout efficiency.
• Plan and validate netlist mappings across dies, interposers, and substrates.
• Define die placement, padstacks, net assignments, and package-level connectivity.
• Create and maintain Package Requirement Documents (PRDs) covering die arrangements, stackups, and design constraints.

What you'll need

• 5-12 years of related professional experience.
• Experience developing netlists and schematics for large, complex packages.
• Experience developing C4 and BGA ball maps for high-pin-count designs.
• Proficiency with Cadence tools such as OrbitIO / Integrity System Planner (ISP) or equivalent.
• Foundational understanding of package design concepts including design rules, breakout, place and route, shielding, reference planes, and power distribution.
• Solid SI/PI fundamentals across substrate, board, and system levels.

Details

• Location: Bangalore.