Principal Hardware Engineer

Overview

Principal Hardware Engineer role within HPE's Networking BU, designing and delivering routers and Ethernet switches for hyperscale data centres, AI, service provider and enterprise networks.

What you'll do

• Own end-to-end responsibility for designing and delivering the product.
• Work closely with the PLM team to understand market requirements and define architecture details.
• Define architecture, product description details, and author hardware functional specifications.
• Complete the hardware design flow: schematic entry, component selection, and coordination with eCAD, PCB layout, SI, power, mechanical, thermal and FPGA teams.
• Specify PCB stack-up and work with PCB vendors, supply chain and manufacturing teams.
• Work with CM and/or ODM partners and take the product through its full lifecycle from prototype to production.
• Lead hardware bring-up and testing, supporting EDVT, MDVT, EMC, HALT, SI and IEEE test teams.
• Work with the Diagnostic Software team for design validation and manufacturing testing.
• Work with Software and Software Test teams to debug complex system issues.
• Develop organization-wide architectures and methodologies for electrical hardware design across multiple platforms and organizations within the Global Business Unit.
• Identify and evaluate new technologies, innovations and outsourced development partner relationships for alignment with the technology roadmap and business value.
• Review and evaluate designs and project activities for compliance with technology and development guidelines and standards.
• Leverage domain expertise to influence decisions of executive business leadership, outsourced development partners and industry standards groups.
• Provide guidance and mentoring to less-experienced staff members.

What you'll need

• Bachelor's or Master's degree in Electrical Engineering.
• Typically 15+ years of experience.
• Using electrical design tools and software packages.
• Excellent analytical and problem-solving skills.
• Experience designing hardware using high-speed serial interfaces at 50G and 100G with NRZ and PAM4.
• Experience with x86 CPU architecture.
• Experience designing high layer count boards (18+ layers) including 50G+ signals and advanced PCB manufacturing technologies.
• Experience working with multi-phase DC/DC converters for high current, high transient loads.
• Experience working with high-speed interfaces such as DDR4, DDR5, LPDDR, PCIe Gen3, PCIe Gen4 and NVMe SSD.
• Experience in overall architecture of electronic hardware for products and solutions.
• Designing and integrating electronic components, integrated circuitry and algorithms into overall architecture.
• Evaluating, proposing and selecting empirical analysis, modeling and testing methodologies to validate component, circuit and hardware designs and thermal/emissions management.
• History of innovation with multiple patents in electronics packaging.
• Excellent written and verbal communication skills; mastery of English and the local language.
• Ability to communicate product architectures, design proposals and negotiate options at business unit and executive levels.

Details

• Hybrid role: on average 2 days per week from an HPE office.
• Location: Bengaluru, Karnātaka, India.
• Job level: TCP_05.