PWB Designer, Senior Lead

Overview

Senior PWB design lead in the Corporate Engineering unit (PWB CAD department) providing printed wiring board design solutions for high-performance electronic assemblies for Mobile, Modem and IOT, working with US and India teams.

What you'll do

• Provide PWB design solutions for product test engineering designs (UFLEX/IFLEX probe cards, 93K DIB, bench boards and daughter cards, socketed and solder-down, HTOL, etc.) with multiple DUT sites up to 32X.
• Design large, high-density emulator boards with high layer counts (24-34 layers), several FPGAs (>1500 pins) and very high-speed digital signals.
• Design form-factor-accurate reference handset circuit boards requiring mastery of digital processors, RF and radio circuits, and power control devices.
• Use PWB CAD design software daily to perform placement and routing to meet mechanical and electrical design constraints.
• Exchange electronic files with mechanical and electrical engineers to ensure fit, form, function, and power and signal integrity requirements are met.
• Create fabrication and assembly drawings and work with internal teams and external suppliers to support PWB fabrication and assembly.
• Direct, capture and interface with outside consultants on multi-disciplined projects.
• Provide input into process improvement, PWB and DFM checklists and guidelines.
• Resolve PWB design issues with fabrication and assembly vendors.
• Prepare and deliver design reviews to the project team.

What you'll need

• Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience, OR High School diploma or equivalent and 7+ years of PCB layout handling or related work experience.
• 6-9 years actively involved in PWB design for high-density electronics packaging.
• 6-9 years of experience in a PWB design role designing consumer-grade mobile phones utilizing latest generation processor chips.
• Proficiency on Mentor Xpedition, Mentor PADS and Cadence Allegro PWB design software.
• Experience developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.
• Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using 0.5mm pitch and smaller packages.
• Design experience with RF, analog and high-speed digital circuits (DDR2, 3 and 4, HDMI, PCIe, SATA, MIPI, USB 2/3.x, GigE).
• Experience with ATE platforms 93K, uFlex and iFlex.
• Design for Manufacture (DFM) analysis experience using Valor and/or CAM350 tools.
• Strong understanding and demonstrated application of PWB design principles, practices and standards.
• Ability to perform complex PWB design tasks requiring knowledge of fabrication and assembly process capabilities and limitations.
• Leadership skills to help direct, prioritize and set project tasks per schedule, and to communicate milestones to outside team members.
• Excellent verbal and written communication skills.

Nice to have

• Experience working with on-board EMI shielding cans.
• Experience with IDF/EMN file exchange between mechanical and HW teams.

Details

• Location: Bangalore, India.
• Employer: Qualcomm India Private Limited.