RF Module Design Engineer, Senior

Overview

Qualcomm's RF EM team is seeking engineers to design and model RF passive components for use in RFIC designs, including RF package, module and PCB design and modeling.

What you'll do

• Design and develop RF passive components for next-generation highly integrated RF integrated circuits in deep sub-micron 28nm and 14ff CMOS and SOI technologies.
• Work with the RF circuit design team to optimize component sizes and performance for use in RF circuit blocks.
• Deliver components that include compact models and DRC clean physical designs.
• Execute isolation analysis and optimization to reduce on-chip and chip to package coupling.
• Optimize multichip carriers for RF systems, focusing on loss and isolation.
• Participate in RF package, module and PCB level design and modeling to optimize overall system level performance.

What you'll need

• Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience, OR Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience, OR PhD in Science, Engineering, or related field.
• Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters.
• Experience in design and modeling of RF modules for RF and mmWave frequency.
• Demonstrated abilities with EM simulation techniques and tools including MoM EM solvers (EMX, PeakView, Helic) and HFSS.
• Experience with circuit design and layout using Cadence tools and Agilent ADS.
• Compact RLCK model extraction of multiport passive components.
• Ability to use EM tools to predict circuit level electric and magnetic coupling.
• Understanding of chip fabrication process and design.
• Understanding of electromagnetic theory, microwave theory and design.
• Antenna design and understanding of radiation and propagation wave.
• Good understanding of SI and PI at chip, package and PCB level.
• Basic RF system understanding.
• Understanding of noise propagation mechanism in chip, package and PCB.
• Passionate self-starter and team player with experience in project leadership and multi-tasking.

Nice to have

• Exposure to RF package, module and PCB design and modeling.
• Knowledge of module and PCB level Power Distribution Network (PDN) and RF transmission line layout and analysis.
• Working experience with programming languages such as Python, Matlab, SKILL.
• Working experience and knowledge of Power Amplifier (PA) and Low Noise Amplifier (LNA) matching, along with basic understanding of patch antenna design parameters and matching.

Details

• Location: Bangalore, India.