Senior Package Layout Engineer - Hardware

Overview

Senior Package Layout Engineer collaborating with the Technical Package Lead and design teams on the design and development of detailed layout of IC substrates for NVIDIA products.

What you'll do

• Collaborate in a Layout team to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.
• Work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What you'll need

• B.S. Electrical Engineering or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Solid understanding of high-speed design signal integrity practices.

Nice to have

• Experience with HDI designs.
• Proven experience in substrate layout of wire bond and flip chip packages.
• Experience with Virtuoso and Calibre.
• Experience using Valor.

Details

• Location: India, Bengaluru.
• Work mode: Hybrid.