Overview
Design and develop motherboards, add-in cards and modules for Qualcomm's new AI SoC/SiP, and support rack-level design and integration of cards, servers and networking switches for next-generation liquid-cooled data centers.
What you'll do
- Develop basic features and components of hardware designs in line with product proposals or roadmaps, under the supervision of more experienced engineers.
- Apply basic design rules and processes for electronic hardware, equipment, and/or integrated circuitry with minimal supervision from more experienced engineers.
- Read device specification sheets and interpret basic details required to design various hardware features with minimal guidance from more experienced engineers.
- Evaluate devices and document performance over various operating conditions and configurations.
- Assist in the assessment of common design features to identify potential flaws (electrical, mechanical, hardware), compatibility issues, and/or compliance issues under the supervision of more experienced engineers.
- Document basic details about materials, components, chipsets, and assemblies for a device, and record important changes to design with minimal supervision from more experienced engineers.
- Troubleshoot basic issues with product designs.
- Provide a reasonable schedule for own tasks to the project lead.
- Develop understanding of Qualcomm products.
- Work with ODMs on joint design, address technical issues and support mass production.
- Seek basic knowledge of industry trends, competitor products, and advances in various engineering fields from publicly available information; consult more experienced engineers to understand and apply advanced concepts.
- Work with cross-functional teams (mechanical, thermal, SI, PTE, regulatory, validation, manufacturing, etc.) to execute projects from concept to production.
- Support rack-level design and integration of cards, servers and networking switches.
What you'll need
- Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
- OR Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
- OR PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3 to 15 years of Hardware Engineering or related work experience.
- OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
- OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.
- 3 to 15 years of experience in HW board design and System design.
- System/card/rack-level development, including architecture, design, validation, and deployment of enterprise-class hardware platforms.
- Strengths in any of the following areas: rack-level system integration (chassis, backplane, cabling, airflow, thermal management across multiple cards/modules).
- Familiarity with rack-scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards.
- Experience with rack-level diagnostics and bring-up, including debug of interconnects, signal integrity across long traces/cables, and system-level validation.
- Understanding of rack-level mechanical constraints, EMI shielding, and compliance with data center deployment standards.
- Collaboration with ODMs/OEMs on rack-level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing.
- Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery.
- Expertise in chassis design, airflow optimization, and thermal management.
- Solid understanding of system software operation from bootloader to OS and application layers.
- Experience qualifying PMICs, voltage regulators (VRs), clock buffers, flash memory, and connectors for use in complex card and rack-level designs.
- Hands-on experience in dense, high-layer count PCB designs (8–20+ layers).
- Skilled in PCIe add-in card/module design, debugging in high-performance systems (x86 and ARM).
- Familiarity with JTAG tools for bring-up and debug.
- Experience with networking switches and high speed ethernet interfaces.
- Knowledge of high-speed serial I/O (6–10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE.
- Experience with long PCB/cable topologies (0.35–1.5 meter), signal integrity, and compliance with current standards.
- Ability to debug at packet/protocol level across link, transport, transaction, and command layers.
- Experience with LPDDR4x memory technologies, DIMM layout and validation.
- Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration.
- Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition).
- Experience with circuit simulation tools (SPICE), signal/power integrity analysis.
- Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers.
- Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines.
- Good understanding of x86 FW/SW stack and firmware architecture.
- Experience with BMC hardware/software integration and management.
- Familiarity with regulatory, environmental, and compliance testing for rack-level systems.
Nice to have
- 3 to 15 years hardware engineering/Systems development experience or related work experience.
- 3 to 15 years of experience with circuit design (e.g., digital, analog, RF).
- 3 to 15 years of experience utilizing schematic capture and circuit simulation software.
- 3 to 15 years of experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, debug tools, etc.
Details
- Location: Bangalore, India.
Read the full description and apply on the company’s own careers page.