Advanced Packaging Intern

Overview

Marvell's central advanced packaging organization designs advanced IC packages that support high speed interfaces, shaping product performance, reliability and time to market. This is an internship in that organization for the 2027 calendar year.

What you'll need

• Strong foundational understanding of package design, including design rules, breakout, place and route, signal shielding, reference planes, power distribution, and pinout optimization across package and system requirements
• Solid grasp of SI/PI fundamentals at the substrate, board, and system levels
• Knowledge of 2D, 2.5D, and emerging packaging architectures such as CoWoS-S/R/L, EMIB, CPO, and CPC
• High-level understanding of thermal and mechanical package constraints (e.g., warpage, TIM)
• Experience contributing to tool, process, and flow development, including library maintenance and basic scripting for automation
• Familiarity with foundry design rules and substrate manufacturing constraints
• Demonstrated ability to work across cross-functional teams and global time zones; strong interpersonal skills and willingness to learn
• Experience collaborating with chip and board design, and electrical simulation teams for co-design and optimization
• Strong communication, presentation, and documentation skills

Nice to have

• Familiarity with running and interpreting signal and power simulations

Details

• Location: Bangalore
• Approved Intern for 2027 Calendar Year
• Candidates may be subject to an export license review process prior to employment, unless they are U.S. citizens, lawful permanent residents, or protected individuals
• AI tools are not permitted during interviews