Mechanical Simulation Engineer – Advanced Packaging

Overview

Mechanical Simulation Engineer focused on thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies.

What you'll do

• Run linear and non-linear static analysis for package and material behavior.
• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages.
• Build multiphysics models spanning thermo-mechanical, thermal, structural, and fluidic domains.
• Model interfaces and damage mechanisms such as contact, shear, delamination, and interfacial damage.
• Integrate Generative AI/AI Assistant and AI techniques to accelerate simulations and improve predictive analytics.
• Develop automation workflows for simulation setup, solve, and post-processing and reduce turnaround time.
• Collaborate with cross-functional teams across packaging architecture and assembly process integration.

What you'll need

• 2–5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains.
• Experience in AI-driven modeling, automation, or data-driven simulation techniques (preferred).
• Ability to develop and validate material models for polymers, composites, and thin-film stacks.
• Knowledge of material characterization workflows.
• Experience performing failure and reliability analysis, including fatigue life and crack propagation.

Details

• Location: Hyderabad, Telangana, India.
• Work focus includes HBM, 2.5D/3D integration, TSV, and hybrid bonding technologies.