Senior Package Layout Engineer - Hardware

Overview

Senior Package Layout Engineer on NVIDIA's Layout team, implementing high speed/density ASIC packages and collaborating with the Technical Package Lead and design teams on IC substrate layout.

What you'll do

• Collaborate with the Layout team to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pin assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.
• Work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What you'll need

• B.S. in Electrical Engineering or equivalent experience.
• 5+ years of experience in PCB layout of graphics cards, motherboards, line cards or other related technology.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Solid understanding of high-speed design signal integrity practices.

Nice to have

• Experience with HDI designs.
• Proven experience in substrate layout of wire bond and flip chip packages.
• Experience with Virtuoso and Calibre.
• Experience using Valor.

Details

• Location: Bengaluru, India.
• Work mode: Hybrid.