Overview
Create multilayer PCB layouts for controllers, transfer switches, and related home interconnect devices at Generac, taking boards from schematic capture through routing, fabrication, assembly, and bring-up as the layout owner.
What you'll do
- Create and modify multilayer PCB layouts from engineer-provided schematics for controllers, transfer switches, and related interconnect devices, including boards that integrate wireless modules.
- Perform component placement, routing, and copper pour with attention to signal integrity, power integrity, thermal performance, and manufacturability.
- Create and maintain PCB library parts (schematic symbols, footprints, land patterns, and 3D models) in accordance with IPC standards.
- Generate and release complete fabrication and assembly documentation, including Gerber/ODB++ data, drill files, fabrication and assembly drawings, and bills of materials.
- Apply IPC standards (e.g., IPC-2221, IPC-7351, IPC-A-600/610) to design boards for reliability and manufacturability.
- Route mixed-signal, power, and line-connected circuits, maintaining creepage, clearance, and isolation appropriate to the operating voltage.
- Design for EMC/EMI performance using sound grounding, shielding, and layout practices to support agency compliance.
- Address thermal management of power-dense circuits through copper, thermal-via, and heatsinking strategies coordinated with mechanical packaging.
- Partner with Mechanical Design on board outline, connector placement, mounting, and enclosure fit using ECAD/MCAD co-design.
- Support integration of wireless modules and antennas, applying vendor layout guidelines and RF keep-outs.
- Perform design rule checks (DRC) and electrical rule checks (ERC), and participate in PCB design and layout reviews.
- Work with fabrication and assembly suppliers to resolve DFM/DFT issues, obtain quotes, and qualify first articles.
- Support new product introduction (NPI) through prototype bring-up, design verification, and production launch, and help root-cause board-level failures across development, validation, manufacturing, and the field.
- Manage design data and revisions in the PLM/PDM system and contribute to PCB design standards, documentation, and continuous improvement of engineering processes.
What you'll need
- Associate degree in electronics or electrical engineering technology, IPC Certified Interconnect Designer (CID) credential, or equivalent PCB design experience.
- 5+ years of experience laying out multilayer printed circuit boards for electronic or electromechanical products.
- Proficiency with the PCB design tool Altium Designer.
- Experience creating and maintaining PCB library parts (symbols, footprints, and land patterns) to IPC-7351.
- Working knowledge of IPC standards (e.g., IPC-2221, IPC-A-600, IPC-A-610) and PCB fabrication and assembly processes.
- Experience generating complete fabrication and assembly outputs (Gerber/ODB++, drill files, fabrication and assembly drawings, and BOMs).
- Experience routing mixed-signal boards with attention to signal integrity, power distribution, and manufacturability.
- Strong attention to detail with good written and verbal communication skills.
- Experience working with U.S.-based teams or customers, with strong communication and collaboration skills across time zones.
Nice to have
- Experience designing boards for transfer switches, generator controllers, switchgear, or similar power distribution and control products.
- Experience with high-voltage, line-connected board design, including creepage, clearance, and isolation requirements.
- Familiarity with product-safety and agency standards (UL/IEC) and design for EMC/EMI compliance.
- Experience laying out boards that integrate wireless modules and antennas, including RF keep-outs and vendor layout guidelines.
- Experience with ECAD/MCAD co-design and collaboration with mechanical packaging (e.g., Altium–SolidWorks or Allegro–Creo integration).
- Experience with high-speed digital routing, including impedance control, length matching, and signal-integrity considerations.
- Experience addressing thermal performance in PCB layout for power-dense assemblies.
- Familiarity with Design for Manufacturability (DFM), Assembly (DFA), Reliability (DFR), and Test (DFT).
- IPC Certified Interconnect Designer (CID or CID+) certification.
- Experience with PLM/PDM data management and engineering change (ECN) processes.
- Experience with renewable energy, energy storage, or power generation products, given the residential energy focus of our products.
Details
- Location: Pune, India.
- Works in partnership with U.S.-based offices and teams, requiring collaboration across time zones.
Read the full description and apply on the company’s own careers page.