Signal Integrity and Power Integrity Engineer

Overview

Support high-speed package and PCB design as a Signal Integrity and Power Integrity Engineer, working closely with system-hardware and packaging teams to ensure robust high-speed performance and reliable power delivery across products.

What you'll do

• Perform SI/PI analysis, modeling and simulation for high-speed package and PCB designs.
• Work closely with system-hardware and packaging teams to ensure robust high-speed performance.
• Ensure reliable power delivery across products.

What you'll need

• Education: MS/M.Tech in Electronics or equivalent.
• 3–6 years of industry experience in Signal Integrity and Power Integrity for package and/or PCB designs.
• Strong understanding of PDN for Chip packaging/substrate and PCB.
• Hands-on experience with SI/PI tools such as Cadence Sigrity, ADS, Ansys SIwave/HFSS, HyperLynx.
• Ability to analyze S-parameters, impedance profiles, TDR results, and PDN frequency responses.
• Familiarity with package design basics.

Details

• Location: Hyderabad, India.
• Travel: 0% - 25%.