Engineering Lead, Global Instant Payments Platform - Senior Vice President

Overview

Engineering Lead for Citi’s Global Instant Payments Platform, responsible for architecture, development, and delivery of next-generation real-time payment infrastructure.

What you'll do

• Lead architecture, design, and delivery across the SDLC for the Instant Payments platform.
• Design and develop high-performance payment services using Java, distributed systems, and event-driven architectures.
• Modernize payment platforms on AWS using microservices, APIs, containerization, and automated infrastructure practices.
• Build payment capabilities for RTP, FedNow, UPI, SEPA Instant, and other real-time networks across markets and jurisdictions.
• Architect resilient, scalable systems meeting latency, availability, security, and operational resilience needs.
• Lead and mentor engineers, owning technical design reviews, architecture decisions, code quality, and complex issue resolution.

What you'll need

• 12+ years of software engineering experience, including large-scale payment/transaction/financial technology platforms.
• Expert-level Java development with concurrency, JVM performance tuning, asynchronous processing, and low-latency design.
• Proven experience designing and delivering high-throughput, mission-critical enterprise-scale systems.
• 5+ years of hands-on AWS experience deploying and operating cloud-native production applications.
• Expertise in microservices, event-driven architectures, REST APIs, messaging, and streaming technologies such as Kafka.
• Demonstrated deep understanding of instant payments and payment operations lifecycle areas (e.g., reconciliation, settlement, liquidity).

Details

• Location: Pune, Maharashtra, India.
• Employment type: Full time.