IC Package design engineer- 4+ Years

Overview

IC Package design engineer to lead and execute the full package design process for next-generation networking ASICs at Cisco Silicon One.

What you'll do

• Lead package design tasks from concept through implementation and drive schedules.
• Optimize package components including pinouts, stack-ups, power distribution, and high-speed routing.
• Collaborate with floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality.
• Work with layout editors to deliver package designs aligned with interface requirements.
• Enhance package design methodologies and collaborate with vendors to improve quality and efficiency.
• Drive innovation in package solutions for next-generation ASICs.

What you'll need

• Over 3 years of experience in package layout design.
• High-speed layout design skills for PCIe, DDR, and SerDes technologies.
• Proficiency using the Cadence APD layout tool.

Nice to have

• Experience with multi-die package and interposer designs.

Details

• Location: Bangalore, India.