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Lead Engineer - Stress Analyst

Carrier
NewPosted today

LOCATION

Raheja Mindspace · Hybrid

EXPERIENCE

Not specified

TYPE

FullTime

SKILLS REQUIRED

Finite Element AnalysisHeat TransferStructural DynamicsMaterial Plasticity

Job description

Overview

Lead Engineer - Stress Analyst (FEA and electronics cooling simulation) responsible for advanced structural, dynamic, explicit and thermal simulations to support product design, optimization, validation and troubleshooting, working closely with Design, Product, Testing, Manufacturing and Systems Engineering teams.

What you'll do

  • Perform linear static analysis to evaluate stress, strain, deformation, stiffness and load paths.
  • Conduct nonlinear analysis, including material nonlinearity/plasticity, geometric nonlinearity/large deformation, contact and friction, and bolt/fastener and joint behavior.
  • Evaluate sheet-metal, cast, welded, bolted and structural assemblies.
  • Perform design iterations and recommend structural improvements based on simulation results.
  • Support design optimization, weight reduction, material changes, and cost-reduction/VAVE projects.
  • Perform structural dynamic analyses including modal analysis, natural frequency and mode-shape evaluation, harmonic response, random vibration/PSD, shock/transient response and frequency-response assessments.
  • Evaluate resonance risks and recommend design modifications.
  • Support simulation-to-test correlation using vibration and modal test results.
  • Perform explicit nonlinear simulations for highly transient events and develop methodologies for drop tests, impact events, shock loading, component-to-component impact, large deformation and severe contact conditions.
  • Evaluate plastic deformation, acceleration, stress/strain, energy balance, contact forces and structural integrity during impact events.
  • Correlate simulation results with physical drop/impact testing where data is available.
  • Perform electronics cooling and thermal simulations for components, enclosures and systems, evaluating junction temperatures, PCB thermal performance, heat sinks, fans and forced/natural convection, conduction paths, airflow distribution, pressure drop, and hot spots.
  • Assess thermal-management concepts and recommend improvements to cooling architecture.
  • Map thermal or pressure loads from CFD analysis into structural FEA models where required.
  • Perform thermal-structural analysis to evaluate deformation and stresses generated by temperature distributions.
  • Develop high-quality finite element models using 1D, 2D/shell and 3D/solid elements, and define boundary conditions, contacts, joints, connectors, fasteners, materials and loading conditions.
  • Perform mesh-quality and mesh-convergence assessments and CFD-to-FEA load transfer (pressure, temperature and spatially varying load mapping).
  • Review model assumptions and ensure simulation methodologies appropriately represent actual product behavior.
  • Interpret analysis results and translate them into actionable design recommendations.
  • Identify potential structural and thermal weaknesses early in the product-development cycle.
  • Define analysis assumptions, acceptance criteria, margins and limitations.
  • Support design reviews, DFMEA, validation planning and root-cause investigations.
  • Develop engineering reports and presentations documenting objective, methodology, assumptions, boundary conditions, results, conclusions and recommendations.
  • Collaborate with test engineers to improve CAE-to-test correlation and update simulation methodologies based on test results.

What you'll need

  • Strong fundamentals in solid mechanics, strength of materials, finite element methods, structural dynamics, heat transfer, contact mechanics and material plasticity.
  • Understanding of metallic and polymer material behavior.
  • Good understanding of static versus dynamic loading and implicit versus explicit solution methodologies.
  • Ability to assess FEA model quality and recognize unrealistic boundary conditions, contacts, mesh behavior or solver results.
  • Ability to troubleshoot convergence problems in nonlinear simulations.
  • Bachelor's or master's degree in mechanical engineering, aerospace engineering, automotive engineering, applied mechanics, or a related engineering discipline.
  • Relevant hands-on experience in structural/thermal CAE and product-development environments.
  • Strong analytical and problem-solving ability, sound engineering judgment, and ability to independently develop appropriate FEA methodologies.
  • Ability to distinguish modeling issues from actual design problems.
  • Strong communication and technical presentation skills.
  • Effective collaboration with Design, Testing, Systems, Manufacturing and Product Engineering teams.
  • Ability to manage multiple simulation activities and priorities.

Nice to have

  • Hands-on experience with several of: ANSYS Mechanical, ANSYS LS-DYNA, ANSYS Fluent/Icepak, Altair HyperMesh, Altair HyperView, OptiStruct/Radioss, SpaceClaim or equivalent CAD-preparation tools.
  • Experience working with CAD platforms such as Creo, NX or SolidWorks.
  • Knowledge of fatigue and durability assessment.
  • Experience with scripting/automation using Python, APDL, TCL or similar tools.
  • Experience supporting simulation-driven design decisions and physical validation.

Details

  • Location: Hyderabad, India.
  • Employment type: Full time.

Read the full description and apply on the company’s own careers page.

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Lead Engineer - Stress Analyst