Lead IC Package Design Engineer

Overview

Lead IC Package Design Engineer role focused on flip-chip package design and IC–Package–PCB co-design for signal integrity, power integrity, and thermal optimization.

What you'll do

• Lead flip-chip package design with SI/PI and thermal constraints.
• Drive IC–Package–PCB co-design balancing performance, power, cost, technology, and thermal trade-offs.
• Work on die floorplanning, IO placement, and Perform bump definition and routing feasibility.
• Execute 2D/3D EM simulations and apply electromagnetic and transmission line theory.
• Extract and analyze S-parameters and RLGC models to meet SI/PI requirements.
• Validate package and PCB designs in the lab and correlate measurements with simulations.

What you'll need

• 10+ to 15 years of relevant experience in package design.
• BE/BTech or MTech in Electrical/Electronics Engineering.
• Strong expertise in flip-chip package design.
• Experience with IC–Package–PCB co-design for SI/PI and thermal optimization.
• Proven ability to work independently and with cross-functional teams.
• Experience with Cadence Allegro tools (APD/SIP, PCB Editor).
• Experience with modeling tools (Cadence Sigrity PowerSI, ExtractIM, Clarity 3D).

Details

• Location: BANGALORE.