Mechanical Engineer || || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp : 8+ years

Overview

Mechanical Engineer role focused on electro-mechanical packaging for telecom systems, from concept to production. You will use CREO to design chassis/enclosures and support feasibility, prototyping, analysis, and manufacturing readiness.

What you'll do

• Design electro-mechanical packaging for telecom systems using CREO.
• Lead design feasibility, prototyping, and system-level stack-up tolerance studies.
• Drive medium-scale mechanical engineering projects from concept to production.
• Apply thermal and structural simulation expertise (FEA/stress testing) with DVT teams.
• Drive Design for Manufacturing (DFM) and Design for Assembly (DFA) standards.
• Assist manufacturing with fixture design, assembly process improvements, and FMEA for fabrication issues.
• Set BoM standards, select materials, and perform cost model analysis aligned to COGS and RAS goals.

What you'll need

• 8+ years of experience is stated for the role.
• Bachelor’s degree with 10+ years of related experience, OR Master’s degree with 7+ years, OR advanced CREO proficiency is required (as written).
• Strong background in thermal management for high-performance telecom equipment.
• Proven experience in high-volume manufacturing environments.
• Expertise in simulation tools (FEA/CFD) for structural and thermal integrity.
• Advanced proficiency in CREO for complex chassis and enclosure design is listed as a qualification option.

Details

• Location: Bangalore, India.