Overview
Drive end-to-end PPA (Power, Performance, Area) excellence for next-generation AI semiconductor chips, bridging front-end architecture and back-end physical design.
What you'll do
- Drive comprehensive SoC-level power and thermal management architecture.
- Influence microarchitecture, memory hierarchies, and dataflows to minimize dynamic and leakage power for AI inference and training workloads.
- Review and guide RTL implementation to ensure consistency with power and timing goals.
- Collaborate directly with Physical Design (PD) teams to refine area constraints, floorplanning, and multi-voltage domain structures.
- Develop, fine-tune, and build advanced Physical Design recipes (covering synthesis, placement, clock tree synthesis, and routing) tailored to achieve best-in-class PPA targets.
- Partner with EDA vendors and internal teams to drive the adoption and customization of advanced power analysis tools (e.g., PowerArtist, PrimePower, Joules).
- Develop custom scripts and design workflows where standard tools fall short.
- Lead PPA analysis and trade-off discussions across RTL, architecture, and PD teams.
- Act as the central hub to resolve complex bottlenecks and ensure the final silicon meets strict power budgets.
What you'll need
- BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related field.
- 12+ years of semiconductor experience with a deep focus on SoC architecture, low-power RTL design, and Physical Design (PD) implementation.
- Proven track record of delivering complex, high-performance silicon (AI accelerators, GPUs, or advanced SoCs) under stringent PPA constraints.
- Hands-on expertise with power intent (UPF/CPF) and industry-standard power estimation/analysis tools.
- Strong scripting and automation skills (Python, Tcl, Perl) for customizing EDA tool flows and PPA data analysis.
Details
- Location: Bengaluru, Karnataka, or throughout India (remote-friendly with travel).
Read the full description and apply on the company’s own careers page.